It appears that a major smartphone manufacturer is ready to set off a rocket ride several miles ahead of Apple in three critical things—the folding screen technology, AI capabilities, and memory solutions that are of the highest performance.
Industry watchers are quite sure that this rival, whose identity is still a mystery, will become the first to use HBM (High Bandwidth Memory) DRAM in a smartphone that is sold in the market—thus, they will be one step ahead of Apple.
HBM DRAM, which is the core of 3D stacking technology, provides a significantly higher data transfer rate and greatly lower energy consumption compared to conventional DRAM. On the other hand, the small form factor is perfect for AI-powered mobile devices, where performance and energy saving are very important.
This novel idea may become the unnamed party’s winning card in the future when AI is deeply combined with smartphones. According to the experts’ opinion, besides being the most powerful memory for running AI at the edge, as HBM DRAM is mentioned, the left turn of mobile memory architecture is indicated by its early implementation.
Besides HBM DRAM, the brand name is supposed to be the first place in the goal index of folding ratio improvements and AI functions, which are also the two main areas where Apple is still working on. With the mobile race for technology going further and further, this step sets a new pace of life and high rules for the coming product line of the Apple firm.
As if now DCS had mention there is no evidence that Apple will take any move, but local supply chains are moving at a rate that might coincide with Apple’s introduction. The rivalry between Android and Apple is evolving, and it appears that Android OEMs are no longer satisfied to play catching up.
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