MediaTek is coming with some innovation next generation chipset Dimensity 8450 at India Dimensity Summit. In this various brands were entered such as Motorola, Samsung, Vivo, Oppo, Lava, Realme, Infinix.
MediaTek Dimensity 8450 chipset which is integrated with NPU 800 and Agentic AI Engine and Generative AI, also work on advanced AI workloads. MediaTek which is consist on big core CPU and also consist with 8x ARM cortex -A725 cores, 6MB L3 cache+ 5MB SLC. The chipset Dimensity 8450 is power efficient and gives 30% better performance level which is said by firm.
This chipset featured with WQHD+ display resolution 144Hz, it also supports dual screen. for imaging supports upto 1080 ISP in zoom sensor it don’t get lag with zero lag HDR and also PDAF 100%.
While chip connectivity module 5G and 3CC carrier aggregation and also has connectivity rang of 5.17Gbps, also has support of WIFI 6E and Bluetooth 5.4 support. In this there is new technology engine exist which stabilized 4K 60HDR (HLG) EIS dual engine is used.
While gaming support which is Hyper Engine MAGT 3.0 support which gives best next generation gaming enhancement, which has UltraSave 3.0+ power efficiency.
While in event which is conducted there were celebration of one year MediaTek Connect gaming tournament with that MediaTek showed 5G portfolio which was from entry level to flagship.
During the event Dr. Yenchi Lee were speaking at the event he is General Manager of MediaTek Wireless Communications Business unit.
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